Most design engineers are troubled with thermal field and thermal stress problems in pursuit of small size and lightweight of products, which also directly affects the product reliability. In order to meet the demand of design for reliability, the thermal field and thermal stress problems must be solved during the design stage of electronic products.

Using graphic interactive mode to analyze thermal problems, AEC Thermal Field and Thermal Stress Analysis Software is a general-purpose tool for generating and solving thermal models. It uses a Finite Element method to convert geometry into an accurate resistor/capacitor representation which is then accurately and quickly solved using a finite difference method. This combination gives accurate results like other FEA tools but solves in a fraction of the time. 　

Models are created by graphic interactive mode that simplify the processing of nodes and elements. 3 dimensional complex models of real structures are simulated geometrically, like in FEM, using 2D Plate and 3D Brick and Tetrahedron elements. With AEC Thermal Field and Thermal Stress Analysis Software, boundary conditions like thermal convection, thermal radiation, fluid flow, thermal loading, and temperatures are simply applied to the simulated models. Use of Finite difference method easily help solve the traditional tough problems of temperature variance, time variance, boundary conditions, fluid flow, thermal flow, and thermal radiation.