Reliability Testing
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AEC software for fatigue evaluations of electronic circuit cardsEnvironmental Vibration Testing and Environmental Stress Screening have been established as the most effective means of detecting mechanical production flaws. However, how to define proper Environmental Stress Screens is a typical difficulty to most industries as the vibration responses are different for various products. |
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AEC Thermal Field and Thermal Stress Analysis SoftwareMost design engineers are troubled with thermal field and thermal stress problems in pursuit of small size and lightweight of products, which also directly affects the product reliability. In order to meet the demand of design for reliability, the thermal field and thermal stress problems must be solved during the design stage of electronic products. |
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Highly Accelerated Life Testing-HALT SystemHighly Accelerated Life Test (HALT) is a process in which products are subjected to accelerated environments to find weak links in the design and/or manufacturing process. The primary accelerated environments include thermal (both temp limits and rate of change) and vibration (pseudo-random 6 DOF). Other accelerated environments using voltage, frequency, etc. are applied as appropriate for the sample being tested. |
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Thermal Stress Screening SystemThermal Stress Screening uses accelerated stimulus techniques, within strength extremes of designed products, causing potentially defective devices to fail and making them easy to detect. |
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Stress Screening Vibration SystemThis multifunctional screening system is developed by using the characteristics of spectral control and spectral responses. It exhibits the power of close loop spectral control of Electromagnetic shakers, including other capabilities of resonance sorting and control, and is used to precisely detect design defects and extremes of the screened products. |
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Long Distance MicroscopeLong Distance Microscope can be used for microscopic failure analysis from distances of 15cm to 40 cm and for observation of micro change as 1μmm. Analysis of failure characteristics can be processed along with CCD image acquisition systems. Long Distance Microscope is different from the traditional microscope and can precede dynamic observations beyond the normal static observations. |